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ASE Global
We are currently working with major IDMs and the world’s top foundries on polyimide repassivation and RDL, Cu pillar, and 90nm cu low-K wafer bumping. ...
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ASE Global
Pudong New Area, Shanghai 201203, P.R. China Tel: 86-21-5080-1060 #6001. Fax: 86-21-5080-0564 ... UNIVERSAL SCIENTIFIC INDUSTRIAL (USI). TAIWAN ...
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ASE Global
We are currently working with major IDMs and the world’s top foundries on polyimide repassivation and RDL, Cu pillar, and 90nm cu low-K wafer bumping. ...
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ASE Global
Wafer bumping is an essence element of flip chip or board level ... Bumping is an advanced wafer level process technology where “bumps” or “balls” made of ...
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ASE completes internal development of electroplated wafer bumping ...
File Format: PDF/Adobe Acrobat - View as HTML Apr 9, 2003 ... through the high lead process in electroplated wafer bumping. ... developing electroplated wafer bumping process to handle these larger ...
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ISE Offers Semiconductor Companies Worldwide Remote Access to ...
File Format: PDF/Adobe Acrobat - View as HTML ISE Offers Semiconductor Companies Worldwide Remote. Access to Broad Range of Test Platforms ... Open House on July 18(th) in Fremont, California. About ISE ...
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Announcement on the migration of email domain addresses to ...
File Format: PDF/Adobe Acrobat - View as HTML test@email.asetest.com.tw test@aseglobal.com. ASE Material,. Kaohsiung ... To ensure a smooth transition, the existing domain names of each location ...
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ASE first to offer world-leading SCSP and SiP package technologies
File Format: PDF/Adobe Acrobat - View as HTML May 31, 2001 ... stacking technology in the industry. The main application for Sandwich SCSP will ... semiconductor packaging services and, together with its ...
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ASE first to offer world-leading SCSP and SiP package technologies
File Format: PDF/Adobe Acrobat - View as HTML May 31, 2001 ... ASE is using the new Sandwich SCSP and SiP technologies along with its Stacked ... semiconductor packaging services and, together with its ...
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ASE first to offer world-leading SCSP and SiP package technologies
File Format: PDF/Adobe Acrobat - View as HTML May 31, 2001 ... stacking technology in the industry. The main application for Sandwich SCSP will ... semiconductor packaging services and, together with its ...