1.
Capacitive Pressure Sensor E1.3N
File Format: PDF/Adobe Acrobat - View as HTML array with deformable pressure sensitive membranes on top of insu- lated counter electrodes. ... 1: Electric sensor model. Fig. 2: Bode-plot @ P ...
2.
Wafer bonding
microFAB is able to do direct, face-to-face bonding of silicon and pyrex (glass) wafers. The following standard processes are available: ...
3.
Bulk Micromachining
Bulk micromachining (BMM) describes the fabrication process of a device taking advantage of all three space dimensions. In most applications single ...
4.
Polymere Coating
Thin film deposition techniques are used to deposit a wide variety of materials on the wafer surface. This films can be used for their electrical, ...
5.
Wet etching
Standard RCA process (SC1, SC2, HF-dip) is used for wafer cleaning. Special Solvent bathes are available for resist stripping. All standard etch bathes are ...
6.
Sample Board Sensor E1.3N/E8.0T with AD7745
File Format: PDF/Adobe Acrobat - View as HTML tive pressure sensor and an AD7745 (Analog Devices) as ca- ... The AD7745’s capacitance gain is factory calibrated that allows ...
7.
microFAB Bremen
Offers services and manufacturing capacities for the production of microsystems and MEMS, such as sensors and actuators.
8.
visit microFAB
microFAB Bremen is a leading service provider in the field of silicon-based micro-systems technology and a global supplier of customised microsystems. ...
9.
MEMS Products
A wide variety of innovative microsystems developments can be found in the automotive, bio-analysis, environmental and medical, chemical and pharmaceutical ...
10.
Deep Trenches
DRIE is a high aspect ratio, deep trench silicon etching process (Bosch process). The principle of the deep trench silicon etching process is an alternating ...
